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INTEGRATED CIRCUITS
DATA SHEET
TDA1576T FM/IF amplifier/demodulator circuit
Product specification Supersedes data of February 1991 File under Integrated Circuits, IC01 1998 Nov 18
Philips Semiconductors
Product specification
FM/IF amplifier/demodulator circuit
FEATURES * Fully balanced 4-stage limiting IF amplifier * Symmetrical quadrature demodulator * Field strength indication output for 1 mA ammeter * Detune detector for side response and noise attenuation * Detune voltage output * Internal muting circuit * 0 and 180 AF output signals * Reference voltage output * Electronic smoothing of the supply voltage. QUICK REFERENCE DATA SYMBOL VP IP ViIF(rms) PARAMETER supply voltage (pin 1) supply current input sensitivity (RMS value) S/N = 26 dB S/N = 46 dB VoAF(rms) THD S/N AM RR I15 Tamb AF output voltage (RMS value) total harmonic distortion with double resonant circuits signal-to-noise ratio AM suppression ripple rejection maximum indicator output current operating ambient temperature f = 100 Hz Vi > 1 mV CONDITIONS MIN. 7.5 10 -3 dB before limiting 14 - - 60 - - - 43 - -30 TYP. 8.5 16 22 10 55 67 0.02 72 50 48 - - GENERAL DESCRIPTION
TDA1576T
The TDA1576T is a monolithic integrated FM/IF amplifier circuit for use in mono and stereo FM-receivers of car radios or home sets.
MAX. 15 23 35 - - 75 - - - - 2 +80 V
UNIT mA V V V mV % dB dB dB mA C
ORDERING INFORMATION TYPE NUMBER TDA1576T PACKAGE NAME SO20 DESCRIPTION plastic small outline package; 20 leads; body width 7.5 mm VERSION SOT163-1
1998 Nov 18
2
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TDA1576T
V1 V2 QUADRATURE DEMODULATOR 8.3 k 1 10 VP VP +8.5 V 0.1 F 2 CPS 47 F 560 pF QL = 20 fo = 10.7 MHz VAF audio outputs -VAF 3 IF1 33 pF 4 RES1 5 FMON FM on 6 RES2 7 IF2 3.7 k 8 VoAF1 VoAF2 V2 3.7 k 9 10 n.c.
MEH139
BLOCK DIAGRAM
Philips Semiconductors
FM/IF amplifier/demodulator circuit
handbook, full pagewidth
field strength 1 mA detune voltage reference voltage +4.9 V VF 15 Vref 14 Vo(det) 13 Vi(det) 12 n.c. 11 0.47 F
2 V (RMS)
RS RS
ViIF
0.1 F VFB1 19
0.1 F VFB2 18 ViIF 17
zero adjustment of field strength indicator VF0 16
3.6 k 1 nF
GND 20
25 k 25 k
4-STAGE LIMITER/ AMPLIFIER
REFERENCE VOLTAGE LEVEL DETECTOR
MUTE ATTENUATOR 0.5 mA DETUNE DETECTOR
33 pF
6.8 nF
Product specification
TDA1576T
Fig.1 Block diagram.
Philips Semiconductors
Product specification
FM/IF amplifier/demodulator circuit
PINNING SYMBOL PIN VP CPS IF1 RES1 FMON RES2 IF2 VoAF1 VoAF2 n.c. n.c. Vi(det) Vo(det) Vref VF VF0 ViIF VFB2 VFB1 GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 DESCRIPTION positive supply voltage smoothing capacitor of power supply IF signal to resonant circuit resonant circuit input 1 FM-ON, standby switch resonant circuit input 2 IF signal to resonant circuit AF output voltage 1 (0 phase) AF output voltage 2 (180 phase) not connected not connected detune detector input voltage for external audio reference detune detector output voltage reference voltage output level output for field strength zero adjust voltage for field strength FM/IF input signal voltage DC feedback 2 DC feedback 1 ground (0 V)
handbook, halfpage
TDA1576T
VP 1 CPS 2 IF1 3 RES1 4 FMON 5
20 GND 19 VFB1 18 VFB2 17 ViIF 16 VF0
TDA1576T
RES2 6 IF2 7 VoAF1 8 VoAF2 9 n.c. 10
MEH140
15 VF 14 Vref 13 Vo(det) 12 Vi(det) 11 n.c.
Fig.2 Pin configuration.
1998 Nov 18
4
Philips Semiconductors
Product specification
FM/IF amplifier/demodulator circuit
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VP V2, 5, 16 Ptot Tstg Tamb supply voltage (pin 1) voltage on pins 2, 5 and 16 total power dissipation storage temperature operating ambient temperature PARAMETER 0 0 0 -55 -30 MIN. 15 VP 450 +150 +80
TDA1576T
MAX. V V
UNIT
mW C C
THERMAL CHARACTERISTICS SYMBOL Rth j-a PARAMETER thermal resistance from junction to ambient in free air VALUE 85 UNIT K/W
1998 Nov 18
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Philips Semiconductors
Product specification
FM/IF amplifier/demodulator circuit
TDA1576T
CHARACTERISTICS VP = 8.5 V; fIF = 10.7 MHz; RS = 60 ; fm = 400 Hz with f = 22.5 kHz; 50 s de-emphasis (C8-9 = 6.8 nF); Tamb = 25 C and measurements taken in Fig.1; unless otherwise specified. The demodulator circuit is adjusted at minimum second harmonic distortion for ViIF = 1 mV and a deviation f = 75 kHz. SYMBOL VP IP Vref Vref PARAMETER supply voltage (pin 1) supply current V5 = V9 = V13 = 0 I14 = -1 mA V 14 ---------------------V 14 x T short-circuit current I14 < 1.2 mA CONDITIONS MIN. 7.5 10 - - TYP. 8.5 16 MAX. 15 23 - - UNIT V mA
Reference voltage reference voltage (pin 14) reference voltage dependence on temperature maximum output current V 14 output resistor -----------I 14 4.9 0.3 V %/K
I14 R14
4 -
6 60
7.5 150
mA
IF amplifier ViIF(rms) R17-18 C17-18 VoIF(p-p) R3-7 R4-6 C4-6 R8, 9 V8, 9 V ----- input sensitivity (RMS value; pin 17) input resistance input capacitance output voltage at pins 3 and 7 (peak-to-peak value) output resistance -3 dB before limiting ViIF = 200 mV (RMS) ViIF = 200 mV (RMS) Z3, 7 = 10 pF parallel to 1 M 14 10 - 610 200 22 - 5 680 250 35 - - 750 300 V k pF mV
Demodulator input resistance input capacitance output resistance DC offset voltage on output pins at V4-6 = 0 demodulator efficiency V5 > 3 V or V3-7 = 0 or V13 < 0.3 V V 8-9 ------------ V 8-9 ---------------------------------------- ( V P - 3V BE ) V8 + V9 ------------------2V 2 V8 + V9 ------------------2V 2 ---------------------T 20 - 2.9 - - - 30 1 3.7 0 40 40 2.5 4.5 100 - - k pF k mV mV/
demodulator efficiency dependent on supply voltage V/V DC voltage ratio
6.2
mV/
0.653
0.667 10-5
0.680
V/V
V -----T
dependence on temperature
-
-
1/K
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6
Philips Semiconductors
Product specification
FM/IF amplifier/demodulator circuit
TDA1576T
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Field strength output; see Fig.4 V15 output voltage ViIF = 0 ViIF = 1 mV (RMS) ViIF = 250 mV (RMS) S R15 V -----T I15 V16 R16 S control steepness output resistance dependence on temperature V 15 V iIF = ---------------------T x V 15 V5 3 V; V15 = 0 to 5 V 0 1.1 3.2 - - - - - - ViIF = 100 mV; V 15 A = -----------V 16 Detuning detector I12 Z12 input bias current input impedance 5V Z 12 = --------- ; see Fig.5 I 12 V1 = V2 = 7.5 V; R13-14 = 10 k; pins 9 and 12 short-circuit; see Fig.6 V9, 12 = 334 mV V9, 12 = 138 mV V9, 12 = 501 mV V13 = 6 V; see Fig.7 V13 = 2.5 V; V9, 12 = 0 = attenuation factor = 1 dB = 7.2 dB 40 dB I13 input current V13 0.1 V 0.11 0.095 - - 0.12 0.1 0.06 - 0.13 0.105 - -225 V/V V/V V/V nA 0.45 0.75 0.335 0.4 - 0.5 0.8 0.345 0.5 - 0.55 0.85 0.355 0.6 -100 V/V V/V V/V mA nA - 6 20 30 100 - nA M 0.87 0.1 1.5 3.6 0.85 150 0.3 0.25 1.9 4.1 - 200 - V V V V/dec %/K
standby operational cut-off current
-
10 - - 1.2
A
Zero level adjustment internal bias voltage input resistance control steepness 260 19 1.0 mV k V/V
V 13 -------V 14
output voltage ratio for = (V3-7) - (V4-6) - 90
= 9.2 (43 kHz); Q = 20 = 3.5 (16 kHz); Q = 20 = 14 (65 kHz); Q = 20 I13 maximum output current cut-off current Internal audio attenuation; see Fig.8 V 13 -------V 14 output voltage ratio
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Philips Semiconductors
Product specification
FM/IF amplifier/demodulator circuit
TDA1576T
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX. - 3 - -100 1 - -
UNIT
Standby switch; see Fig.9 V5 input voltage for FM on input voltage for FM off linear range I5 V5 -----T input current temperature dependence V 3, 7 ---------------------- = 0.9 ; V 3, 7(max) V19 = 0.3 V V5 = 0 to 2 V V5 = 3.5 to 15 V FM on (3.5VBE) FM off (5VBE) 2.4 - - - - - - 2.5 2.9 350 - - 7 10 V V mV A A mV/K mV/K
Supply voltage smoothing V1-2 R1-2 internal voltage drop internal resistor proportional to V1 - 3VBE 80 5.8 210 8.3 400 10.8 mV k
OPERATING CHARACTERISTICS VP = 8.5 V; fIF = 10.7 MHz; RS = 60 ; fm = 400 Hz with f = 22.5 kHz; 50 s de-emphasis (C8-9 = 6.8 nF); Tamb = 25 C and measurements taken in Fig.1; unless otherwise specified. The demodulator circuit is adjusted at minimum second harmonic distortion with ViIF = 1 mV. SYMBOL PARAMETER CONDITIONS -3 dB before limiting S/N = 26 dB S/N = 46 dB VoAF(rms) VoN AF output voltage (RMS value) noise voltage for ViIF = 0 (RMS value; pins 8 and 9) weighted noise voltage S/N AM signal-to-noise ratio (pins 8 and 9) AM suppression RS = 300 ; f = 250 to 15000 Hz in accordance with "DIN 45405" ViIF = 1 mV (RMS); see Fig.3 ViIF = 0.5 to 200 mV; FM: 70 Hz; 15 kHz; AM: 1 kHz; m = 30% ViIF = 500 mV; V5 = 3 V ViIF = 0.03 to 500 mV operating mute or FM off 3H RR distortion for third harmonic ripple rejection Vripple = 200 mV on VP f = 100 Hz MIN. TYP. MAX. UNIT V V V mV V mV dB dB
IF amplifier and demodulator ViIF(rms) input sensitivity (RMS value) 14 - - 60 - - - - 22 10 55 67 900 2 72 50 35 - - 75 - - - -
FM V8, 9
FM suppression for FM off AFC shift in relation to minimum second harmonic distortion 2H DC offset at second harmonic distortion
80 - - - - 43
- 25 0 0 0.65 48
- - 100 50 - -
dB mV mV mV % dB
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Philips Semiconductors
Product specification
FM/IF amplifier/demodulator circuit
TDA1576T
handbook, full pagewidth
20
MEH166
V8, V9 (dB) 0 S+N
-20
-40
-60 N -80 10-6
10-5
10-4
10-3
10-2
10-1 V 1 i 17 (rms) (V)
Fig.3
AF output voltage level on pins 8 and 9 as a function of ViIF at VP = 8.5 V; fm = 1 kHz; QL = 20 with de-emphasis.
handbook, full pagewidth
5
MEH143
V15 (V) 4
3
2
1
0 10-6
10-5
10-4
10-3
10-2
10-1
ViIF (rms) (V)
1
Fig.4 Field strength output (I16 = 0).
1998 Nov 18
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Philips Semiconductors
Product specification
FM/IF amplifier/demodulator circuit
TDA1576T
handbook, halfpage
MEH144
handbook, halfpage
1
MEH145
I12
V13/V14 Ri
0.5
I12
V9, 12
0 -1.2
-0.8
-0.4
0
0.4
0.8 1.2 V9, 12 (V)
Fig.5 Detuning input impedance.
Fig.6 Detuning curve.
handbook, halfpage
1
MEH146
handbook, halfpage
0
MEH147
Vo (dB)
I13 (mA)
-20
0.5 1.2 |V9, 12| 1 0.5 0
-40
-60
0 0 2 4 V13 (V) 6
-80
0
0.1
0.2
V13 /V14
0.3
Fig.7 Detuning output.
Fig.8 Internal audio attenuation.
1998 Nov 18
10
Philips Semiconductors
Product specification
FM/IF amplifier/demodulator circuit
TDA1576T
handbook, halfpage
2
MEH148
V3-7 V3-7 (max)
1
V5
0 0 1 2 V5 (V) 3
Fig.9 Standby switch.
handbook, full pagewidth
33 pF 3
(1)
39 pF 560 pF
(1)
4 TDA1576T 6 39 pF 7 9 8 33 pF
MBK240
560 pF
L1
1 k
L2
390
C8-9 VoAF
Adjustment of the demodulator circuit is obtained with an IF signal which is higher than the 3 dB limiting level; L2 should be short-circuited or detuned; L1 should be adjusted to minimum d2 distortion, and then L2 to minimum d2 distortion. (1) Coil data: L1 = L2 = 0.38 H; Qo = 70; coil former KAN (C).
Fig.10 An example of the TDA1576T when using a demodulator with two tuned circuits.
1998 Nov 18
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Philips Semiconductors
Product specification
FM/IF amplifier/demodulator circuit
PACKAGE OUTLINE SO20: plastic small outline package; 20 leads; body width 7.5 mm
TDA1576T
SOT163-1
D
E
A X
c y HE vMA
Z 20 11
Q A2 A1 pin 1 index Lp L 1 e bp 10 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT163-1 REFERENCES IEC 075E04 JEDEC MS-013AC EIAJ EUROPEAN PROJECTION A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 13.0 12.6 0.51 0.49 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
8o 0o
ISSUE DATE 95-01-24 97-05-22
1998 Nov 18
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Philips Semiconductors
Product specification
FM/IF amplifier/demodulator circuit
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
TDA1576T
* Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1998 Nov 18
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Philips Semiconductors
Product specification
FM/IF amplifier/demodulator circuit
Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, SQFP HLQFP, HSQFP, HSOP, SMS PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes not suitable not suitable(2) suitable not recommended(3)(4) not recommended(5) suitable suitable suitable suitable suitable
TDA1576T
REFLOW(1)
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
1998 Nov 18
14
Philips Semiconductors
Product specification
FM/IF amplifier/demodulator circuit
NOTES
TDA1576T
1998 Nov 18
15
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For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1998
SCA60
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545102/750/02/pp16
Date of release: 1998 Nov 18
Document order number:
9397 750 04823

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